Invention Application
WO2010069077A1 FACE-TO-FACE (F2F) HYBRID STRUCTURE FOR AN INTEGRATED CIRCUIT
审中-公开
用于集成电路的面对面（F2F）混合结构
- Patent Title: FACE-TO-FACE (F2F) HYBRID STRUCTURE FOR AN INTEGRATED CIRCUIT
- Patent Title (中): 用于集成电路的面对面（F2F）混合结构
-
Application No.: PCT/CA2009/001861Application Date: 2009-12-18
-
Publication No.: WO2010069077A1Publication Date: 2010-06-24
- Inventor: MARTINEZ, Liane , TOPACIO, Roden, R. , LOW, Yip, Seng
- Applicant: ATI TECHNOLOGIES ULC , MARTINEZ, Liane , TOPACIO, Roden, R. , LOW, Yip, Seng
- Applicant Address: 1 Commerce Valley Drive East Markham, Ontario L3T 7X6 CA
- Assignee: ATI TECHNOLOGIES ULC,MARTINEZ, Liane,TOPACIO, Roden, R.,LOW, Yip, Seng
- Current Assignee: ATI TECHNOLOGIES ULC,MARTINEZ, Liane,TOPACIO, Roden, R.,LOW, Yip, Seng
- Current Assignee Address: 1 Commerce Valley Drive East Markham, Ontario L3T 7X6 CA
- Agency: SMART & BIGGAR
- Priority: US12/339,759 20081219
- Main IPC: H01L21/77
- IPC: H01L21/77 ; H01L21/60 ; H01L21/98 ; H01L23/485 ; H01L23/488 ; H01L23/50
Abstract:
An integrated circuit (IC) product includes a redistribution layer (RDL) having at least one conductive layer configured to distribute electrical information from one location to another location in the IC. The RDL also includes a plurality of wire bond pads and a plurality of solder pads. The plurality of solder pads each includes a solder wettable material that is in direct electrical communication with the RDL.
Information query
IPC分类:
