Invention Application
- Patent Title: FLOW-THROUGH SUBSTRATES AND METHODS FOR MAKING AND USING THEM
- Patent Title (中): 流通基板及其制造和使用的方法
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Application No.: PCT/US2009/068706Application Date: 2009-12-18
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Publication No.: WO2010080602A2Publication Date: 2010-07-15
- Inventor: BOOKBINDER, Dana, C. , GADKAREE, Kishor, P. , SHUSTACK, Paul, J. , WU, Shaole
- Applicant: CORNING INCORPORATED , BOOKBINDER, Dana, C. , GADKAREE, Kishor, P. , SHUSTACK, Paul, J. , WU, Shaole
- Applicant Address: 1 Riverfront Plaza Corning, New York 14831 US
- Assignee: CORNING INCORPORATED,BOOKBINDER, Dana, C.,GADKAREE, Kishor, P.,SHUSTACK, Paul, J.,WU, Shaole
- Current Assignee: CORNING INCORPORATED,BOOKBINDER, Dana, C.,GADKAREE, Kishor, P.,SHUSTACK, Paul, J.,WU, Shaole
- Current Assignee Address: 1 Riverfront Plaza Corning, New York 14831 US
- Agency: NONI, Lisa, M.
- Priority: US61/139,097 20081219
- Main IPC: B01J20/02
- IPC: B01J20/02 ; B01J20/22 ; B01J20/28 ; B01D53/04
Abstract:
A flow-through substrate comprising a sulfur-containing compound distributed throughout the flow-through substrate structure. The flow-through substrate may be used, for example, in the removal of a heavy metal from a fluid such as a gas stream.
Information query
