Invention Application
WO2010102229A1 WIRE-BONDED INTEGRATED CIRCUIT PACKAGE WITHOUT PACKAGE SUBSTRATE AND INCLUDING METAL TRACES LINKING TO EXTERNAL CONNECTION PADS ROUTED UNDER INTEGRATED CIRCUIT DIE.
审中-公开
无捆扎基板的线路结合集成电路封装，包括连接到集成电路DIE外部连接垫的金属线。
- Patent Title: WIRE-BONDED INTEGRATED CIRCUIT PACKAGE WITHOUT PACKAGE SUBSTRATE AND INCLUDING METAL TRACES LINKING TO EXTERNAL CONNECTION PADS ROUTED UNDER INTEGRATED CIRCUIT DIE.
- Patent Title (中): 无捆扎基板的线路结合集成电路封装，包括连接到集成电路DIE外部连接垫的金属线。
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Application No.: PCT/US2010/026394Application Date: 2010-03-05
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Publication No.: WO2010102229A1Publication Date: 2010-09-10
- Inventor: LAM, Ken, M.
- Applicant: ATMEL CORPORATION , LAM, Ken, M.
- Applicant Address: 2325 Orchard Parkway San Jose, California 95131 US
- Assignee: ATMEL CORPORATION,LAM, Ken, M.
- Current Assignee: ATMEL CORPORATION,LAM, Ken, M.
- Current Assignee Address: 2325 Orchard Parkway San Jose, California 95131 US
- Agency: GOTTLIEB, Kirk, A. et al.
- Priority: US12/399,200 20090306
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/60 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/552 ; H01L23/08
Abstract:
An integrated circuit assembly comprises an integrated circuit die, and a routable metal layer comprising metal traces linking a plurality of wire bond pads to a plurality of external connection pads such that the metal traces are routable under the die area. An electrically nonconductive adhesive layer couples the integrated circuit die to the routable metal layer, and a plurality of wire bonds link circuitry on the integrated circuit die to the wire bond pads in the routable metal layer. An overfill material encapsulates at least the integrated circuit die and the plurality of wire bonds, and a plurality of solder balls are formed on the plurality of external connection pads.
Information query
IPC分类:
