Invention Application
WO2010148313A3 POLYCRYSTALLINE DIAMOND CUTTING ELEMENTS WITH ENGINEERED POROSITY AND METHOD FOR MANUFACTURING SUCH CUTTING ELEMENTS
审中-公开
具有工程孔隙的多晶金刚石切割元件及制造这种切割元件的方法
- Patent Title: POLYCRYSTALLINE DIAMOND CUTTING ELEMENTS WITH ENGINEERED POROSITY AND METHOD FOR MANUFACTURING SUCH CUTTING ELEMENTS
- Patent Title (中): 具有工程孔隙的多晶金刚石切割元件及制造这种切割元件的方法
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Application No.: PCT/US2010039184Application Date: 2010-06-18
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Publication No.: WO2010148313A3Publication Date: 2011-04-07
- Inventor: FAN GUOJIANG , YU FENG , FANG YI , BELNAP J DANIEL , CARIVEAU PETER T
- Applicant: SMITH INTERNATIONAL , FAN GUOJIANG , YU FENG , FANG YI , BELNAP J DANIEL , CARIVEAU PETER T
- Assignee: SMITH INTERNATIONAL,FAN GUOJIANG,YU FENG,FANG YI,BELNAP J DANIEL,CARIVEAU PETER T
- Current Assignee: SMITH INTERNATIONAL,FAN GUOJIANG,YU FENG,FANG YI,BELNAP J DANIEL,CARIVEAU PETER T
- Priority: US21838209 2009-06-18
- Main IPC: E21B10/54
- IPC: E21B10/54 ; B22F3/12 ; B22F7/06 ; E21B10/42
Abstract:
A method for facilitating infiltration of an infiltrant material into a TSP material during re- bonding of the TSP material to a substrate, by enhancing the porosity of the TSP material near the interface with the substrate is provided. Cutting elements formed by such method and downhole tools including such cutting elements are also provided.
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