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    THERMALLY STABLE DIAMOND BONDED MATERIALS AND COMPACTS
    2.
    发明申请
    THERMALLY STABLE DIAMOND BONDED MATERIALS AND COMPACTS 审中-公开
    耐热稳定的金刚石粘合材料和压力

    公开(公告)号：WO2011084645A1

    公开(公告)日：2011-07-14

    申请号：PCT/US2010/060865

    申请日：2010-12-16

    Applicant: SMITH INTERNATIONAL, INC. ,  VORONIN, Georgiy ,  BELNAP, J., Daniel

    Inventor： VORONIN, Georgiy ,  BELNAP, J., Daniel

    IPC: C04B35/52 ,  C01B31/06

    CPC classification number: B24D3/34 ,  B24D18/0009 ,  C01B32/28 ,  C04B35/52 ,  C04B35/6316 ,  C04B35/645 ,  C04B2235/3826 ,  C04B2235/404 ,  C04B2235/427 ,  C04B2235/428 ,  C04B2235/5436 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2235/80 ,  Y10T428/24996 ,  Y10T428/30

    Abstract: Thermally stable diamond bonded construction comprise a diamond bonded body including a thermally stable region, comprising a plurality of diamond grains bonded together by a reaction product of the diamond grains with a reactant such as Si, and a polycrystalline diamond region, comprising intercrystalline bonded diamond and a catalyst material. The body further comprises a ceramic compound formed by reaction of an Nb, Zr, Ti, or Mo getter material with a gaseous element generated during HPHT sintering of the diamond bonded body. The diamond bonded body may comprise from 0.1 to 15 percent by weight of the ceramic compound. The diamond bonded body can be formed during a single HPHT process operated at different temperatures when the reactant has a melting temperature above the catalyst material. The construction may include a metallic substrate attached to the diamond bonded body to facilitate use as a wear or cutting element.

    Abstract translation: 热稳定的金刚石粘合结构包括金刚石粘合体，其包括热稳定区域，其包括通过金刚石晶粒与诸如Si的反应物的反应产物和多晶金刚石区域结合在一起的多个金刚石晶粒，所述多晶金刚石区域包括晶间结合金刚石和 催化剂材料。 身体还包括通过Nb，Zr，Ti或Mo吸气剂材料与在金刚石粘合体的HPHT烧结期间产生的气态元素反应形成的陶瓷化合物。 金刚石结合体可以包含0.1至15重量％的陶瓷化合物。 当反应物的熔融温度高于催化剂材料时，可在不同温度下操作的单一HPHT工艺中形成金刚石粘结体。 该结构可以包括附接到金刚石结合体的金属基底，以便于用作磨损或切割元件。

    HIGH DIAMOND FRAME STRENGTH PCD MATERIALS
    6.
    发明申请
    HIGH DIAMOND FRAME STRENGTH PCD MATERIALS 审中-公开
    高金刚石框架强度PCD材料

    公开(公告)号：WO2012145351A3

    公开(公告)日：2013-05-02

    申请号：PCT/US2012034002

    申请日：2012-04-18

    Applicant: SMITH INTERNATIONAL ,  YU FENG ,  BELNAP J DANIEL

    Inventor： YU FENG ,  BELNAP J DANIEL

    IPC: E21B10/46 ,  C09K3/14 ,  C22C26/00

    CPC classification number: E21B10/55 ,  B24D18/0009 ,  E21B10/46

    Abstract: The present disclosure relates to cutting elements incorporating polycrystalline diamond bodies used for subterranean drilling applications, and more particularly, to polycrystalline diamond bodies having high diamond frame strength and methods for forming and evaluating such polycrystalline diamond bodies. A polycrystalline diamond body is provided, having a top surface, a cutting edge meeting the top surface, and a first region including at least a portion of the cutting edge. The first portion exhibits a diamond frame strength of about 1200 MPa or greater, or about 1300 MPa or greater.

    Abstract translation: 本公开涉及包含用于地下钻井应用的多晶金刚石体的切割元件，更具体地，涉及具有高金刚石框架强度的多晶金刚石体以及用于形成和评估这种多晶金刚石体的方法。 提供多晶金刚石体，其具有顶表面，与顶表面相遇的切割边缘，以及包括切削刃的至少一部分的第一区域。 第一部分具有约1200MPa或更大，或约1300MPa或更大的金刚石框架强度。

    POLYCRYSTALLINE DIAMOND CONSTRUCTIONS HAVING OPTIMIZED MATERIAL COMPOSITION
    7.
    发明申请
    POLYCRYSTALLINE DIAMOND CONSTRUCTIONS HAVING OPTIMIZED MATERIAL COMPOSITION 审中-公开

    公开(公告)号：WO2012071515A3

    公开(公告)日：2012-05-31

    申请号：PCT/US2011/062047

    申请日：2011-11-23

    Applicant: SMITH INTERNATIONAL, INC. ,  BELNAP, J., Daniel ,  VORONIN, Georgiy ,  YU, Feng ,  CARIVEAU, Peter

    Inventor： BELNAP, J., Daniel ,  VORONIN, Georgiy ,  YU, Feng ,  CARIVEAU, Peter

    IPC: B22F7/06 ,  C22C26/00 ,  E21B10/46 ,  E21B10/55 ,  E21B10/567

    Abstract: Diamond bonded constructions include a diamond body comprising intercrystalline bonded diamond and interstitial regions. The body has a working surface and an interface surface, and may be joined to a metallic substrate. The body has a gradient diamond volume content greater about 1.5 percent, wherein the diamond content at the interface surface is less than 94 percent, and increases moving toward the working surface. The body may include a region that is substantially free of a catalyst material otherwise disposed within the body and present in a gradient amount. An additional material may be included within the body and be present in a changing amount. The body may be formed by high-pressure HPHT processing, e.g., from 6,200 MPa to 10,000 MPa, to produce a sintered body having a characteristic diamond volume fraction v. average grain size relationship distinguishable from that of diamond bonded constructions form by conventional-pressure HPHT processing.

    POLYCRYSTALLINE DIAMOND CONSTRUCTIONS HAVING OPTIMIZED MATERIAL COMPOSITION
    8.
    发明申请
    POLYCRYSTALLINE DIAMOND CONSTRUCTIONS HAVING OPTIMIZED MATERIAL COMPOSITION 审中-公开
    具有优化材料组成的多晶金刚石结构

    公开(公告)号：WO2012071515A2

    公开(公告)日：2012-05-31

    申请号：PCT/US2011062047

    申请日：2011-11-23

    Applicant: SMITH INTERNATIONAL ,  BELNAP J DANIEL ,  VORONIN GEORGIY ,  YU FENG ,  CARIVEAU PETER

    Inventor： BELNAP J DANIEL ,  VORONIN GEORGIY ,  YU FENG ,  CARIVEAU PETER

    IPC: B22F7/06 ,  C22C26/00 ,  E21B10/46 ,  E21B10/55 ,  E21B10/567

    CPC classification number: B24D18/0009 ,  B22F3/15 ,  B22F2005/001 ,  B24D3/10 ,  C22C26/00 ,  C22C2026/005 ,  C22C2026/006 ,  C22C2026/007 ,  C22C2026/008 ,  C22C2204/00 ,  E21B10/567 ,  Y10T428/249954 ,  Y10T428/249961 ,  Y10T428/30

    Abstract: Diamond bonded constructions include a diamond body comprising intercrystalline bonded diamond and interstitial regions. The body has a working surface and an interface surface, and may be joined to a metallic substrate. The body has a gradient diamond volume content greater about 1.5 percent, wherein the diamond content at the interface surface is less than 94 percent, and increases moving toward the working surface. The body may include a region that is substantially free of a catalyst material otherwise disposed within the body and present in a gradient amount. An additional material may be included within the body and be present in a changing amount. The body may be formed by high-pressure HPHT processing, e.g., from 6,200 MPa to 10,000 MPa, to produce a sintered body having a characteristic diamond volume fraction v. average grain size relationship distinguishable from that of diamond bonded constructions form by conventional-pressure HPHT processing.

    Abstract translation: 金刚石结合结构包括包含晶间结合金刚石和间隙区域的金刚石主体。 主体具有工作表面和界面表面，并且可以连接到金属基底。 主体的梯度金刚石体积含量大于约1.5％，其中界面处的金刚石含量小于94％，并且朝向工作表面增加。 该主体可以包括基本上不含催化剂材料的区域，否则该催化剂材料设置在主体内并且以梯度量存在。 另外的材料可以包含在身体内并且以不断变化的量存在。 该主体可以通过高压HPHT处理形成，例如从6,200MPa至10,000MPa，以产生特征金刚石体积分数与通过常规压力形成的金刚石结合结构区别的平均粒度关系的特征的烧结体 HPHT处理。

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