Invention Application
WO2011031589A2 METHODS AND ARRANGEMENT FOR DETECTING A WAFER-RELEASED EVENT WITHIN A PLASMA PROCESSING CHAMBER
审中-公开
用于检测等离子体处理室中的散发事件的方法和装置
- Patent Title: METHODS AND ARRANGEMENT FOR DETECTING A WAFER-RELEASED EVENT WITHIN A PLASMA PROCESSING CHAMBER
- Patent Title (中): 用于检测等离子体处理室中的散发事件的方法和装置
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Application No.: PCT/US2010/047380Application Date: 2010-08-31
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Publication No.: WO2011031589A2Publication Date: 2011-03-17
- Inventor: VALCORE JR., John, C. , ZERELLA, Mark
- Applicant: LAM RESEARCH CORPORATION , VALCORE JR., John, C. , ZERELLA, Mark
- Applicant Address: 4650 Cushing Parkway Fremont, California 94538 US
- Assignee: LAM RESEARCH CORPORATION,VALCORE JR., John, C.,ZERELLA, Mark
- Current Assignee: LAM RESEARCH CORPORATION,VALCORE JR., John, C.,ZERELLA, Mark
- Current Assignee Address: 4650 Cushing Parkway Fremont, California 94538 US
- Agency: NGUYEN, Joseph, A.
- Priority: US12/557,381 20090910; US12/557,387 20090910
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/687 ; H01L21/205 ; H01L21/3065
Abstract:
A method for identifying an optimal time for mechanically removing a substrate from a lower electrode in a processing chamber of a plasma processing system is provided. The method includes employing a set of sensors to monitor a set of electrical characteristics of a plasma, wherein the plasma is formed over the substrate during a dechuck event. The method also includes sending processing data about the set of electrical characteristics to a data collection device. The method further includes comparing the processing data against a set of threshold values. The method yet also includes, if the processing data traverses the threshold values, removing the substrate from the lower electrode since a substrate-released event has occurred.
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