The present invention relates to a process for making electrostatic charge dissipative material comprising the following steps: (a) optionally pretreating a substrate in a plasma field; (b) flash evaporating at least one monomer and at least one hygroscopic additive into a vacuum chamber to produce a vapor; (c) condensing the vapor on the substrate to produce a film of the monomer and the hygroscopic additive coating on the substrate; and (d) curing the monomer of the film to produce a polymeric layer containing hygroscopic additive on the substrate; wherein the condensing step is carried out under vapor-density and residence-time conditions that limit the polymeric layer to a maximum thickness of about 3.0 µm. The electrostatic charge dissipative material can be used to protect electrostatic sensitive electronic components.