Invention Application

Abstract:
Surface-modified adhesives may be prepared by contacting an adhesive layer to an electrically conductive layer on a releasing substrate and removing the adhesive layer such that at least a portion of the electrically conductive layer adheres to the adhesive surface. The modified adhesive surface becomes an electrically conductive adhesive surface. The modified adhesive layer can be used to prepare adhesive articles, including articles containing multiple surface-modified adhesive layers.
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