ANTIREFLECTIVE TRANSPARENT EMI SHIELDING OPTICAL FILTER
    2.
    发明申请
    ANTIREFLECTIVE TRANSPARENT EMI SHIELDING OPTICAL FILTER 审中-公开
    抗反射透明电磁干扰屏蔽光学滤波器

    公开(公告)号:WO2011017039A3

    公开(公告)日:2011-06-16

    申请号:PCT/US2010043184

    申请日:2010-07-26

    CPC classification number: G02B1/116 G02B5/207

    Abstract: Antireflective transparent EMI shielding optical filters are provided that can be laminated to optical display devices using optically clear adhesives. The provided filters include electrically-conductive metal or metal alloy layers that can be continuous and patterned or unpatterned. Also included are methods of making the provided filters and touch sensors made using the provided filters.

    Abstract translation: 提供抗反射透明EMI屏蔽光学滤波器,其可使用光学透明粘合剂层压到光学显示设备。 所提供的滤波器包括可以是连续的,图案化的或未图案化的导电金属或金属合金层。 还包括使用提供的滤波器制造提供的滤波器和触摸传感器的方法。

    ELECTRONIC ARTICLES FOR DISPLAYS AND METHODS OF MAKING SAME
    7.
    发明申请
    ELECTRONIC ARTICLES FOR DISPLAYS AND METHODS OF MAKING SAME 审中-公开
    用于显示器的电子文章及其制造方法

    公开(公告)号:WO2011123263A1

    公开(公告)日:2011-10-06

    申请号:PCT/US2011/028939

    申请日:2011-03-18

    CPC classification number: H05B33/145 H01B3/004 H05B33/22

    Abstract: Electronic articles such as, for example, electroluminescent lamps useful for displays and method of making the same are provided. The electronic articles include a substrate, a conductive element adjacent to the substrate, a high dielectric composite adjacent to the conductive element and an electrically-active layer adjacent to at least a portion of the high dielectric composite. The high dielectric composite includes a polymeric binder and from 1 to 80 volume percent of filler retained in the binder. The filler comprises particles that include an electrically-conducting layer and an insulating layer substantially surrounding the electrically-conducting layer. In some embodiments the binder includes a pressure-sensitive adhesive and the composite has adhesive properties.

    Abstract translation: 提供电子制品,例如用于显示器的电致发光灯及其制造方法。 电子制品包括衬底,与衬底相邻的导电元件,与导电元件相邻的高介电复合材料和与高介电复合材料的至少一部分相邻的电活性层。 高介电复合材料包括聚合物粘合剂和1至80体积%的保留在粘合剂中的填料。 填料包括包括导电层和基本上围绕导电层的绝缘层的颗粒。 在一些实施方案中,粘合剂包括压敏粘合剂,并且复合材料具有粘合性质。

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