A microelectronic assembly (100) includes a semiconductor chip (110, 1110) having chip contacts (112) exposed at a first face and a substrate (130, 1130) juxtaposed with a face (128, 129) of the chip (110, 1110). A conductive bond element (144) can electrically connect a first chip contact (112) with a first substrate contact (132, 1132) of the substrate, and a second conductive bond element (146) can electrically connect the first chip contact (112, 132) with a second substrate contact. The first bond element (144) can have a first end (244A, 344A) metallurgically joined to the first chip contact (112, 212A) and a second end (244B, 344B) metallurgically joined to the first substrate contact. A first end (246A, 346A) of the second bond element can be metallurgically joined to the first bond element (212A). The second bond element may or may not touch the first chip contact (112, 212A, 1212) or the substrate contact (132, 1132). A third bond element (948) can be joined to ends of first and second bond elements which are joined to substrate contacts or to chip contacts. In one embodiment, a bond element (740) can have a looped connection, having first and second ends (742, 746) joined at a first contact (732A) and a middle portion (744) joined to a second contact (712A).