Invention Application
- Patent Title: SELF-FOLDING SUB-CENTIMETER STRUCTURES
- Patent Title (中): 自折式分中心结构
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Application No.: PCT/US2011034200Application Date: 2011-04-27
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Publication No.: WO2011139796A3Publication Date: 2012-03-08
- Inventor: GRACIAS DAVID H , AZAM ANUM
- Applicant: UNIV JOHNS HOPKINS , GRACIAS DAVID H , AZAM ANUM
- Assignee: UNIV JOHNS HOPKINS,GRACIAS DAVID H,AZAM ANUM
- Current Assignee: UNIV JOHNS HOPKINS,GRACIAS DAVID H,AZAM ANUM
- Priority: US32846210 2010-04-27
- Main IPC: B81B5/00
- IPC: B81B5/00 ; A61B5/055 ; A61K9/00 ; C12N11/08
Abstract:
A sub-centimeter structure includes a first structural component, a second structural component arranged proximate the first structural component, and a joint connecting the first and second structural components. The joint includes a material that has a first phase that is substantially rigid to hold the first and second structural components in a substantially rigid configuration while the material is in the first phase. The material of the joint has a second phase such that the joint is at least partially fluid to allow the first and second structural components to move relative to each other while the material is in the second phase. The joint interacts with the first and second structural components while the material is in the second phase to cause the first and second structural components to move relative to each other. And, the first and second structural components include a polymer.
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