Invention Application
WO2011145813A3 IMAGE SENSOR HAVING A THREE-DIMENSIONAL STRUCTURE AND METHOD FOR MANUFACTURING SAME
审中-公开
具有三维结构的图像传感器及其制造方法
- Patent Title: IMAGE SENSOR HAVING A THREE-DIMENSIONAL STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Patent Title (中): 具有三维结构的图像传感器及其制造方法
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Application No.: PCT/KR2011003108Application Date: 2011-04-27
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Publication No.: WO2011145813A3Publication Date: 2012-02-23
- Inventor: JEON IN GYUN , AHN HEUI GYUN , WON JUN HO , OH SE JUNG
- Applicant: SILICONFILE TECHNOLOGIES INC , JEON IN GYUN , AHN HEUI GYUN , WON JUN HO , OH SE JUNG
- Assignee: SILICONFILE TECHNOLOGIES INC,JEON IN GYUN,AHN HEUI GYUN,WON JUN HO,OH SE JUNG
- Current Assignee: SILICONFILE TECHNOLOGIES INC,JEON IN GYUN,AHN HEUI GYUN,WON JUN HO,OH SE JUNG
- Priority: KR20100046400 2010-05-18
- Main IPC: H01L27/146
- IPC: H01L27/146
Abstract:
The present invention relates to an image sensor having a three-dimensional (3D) structure and to a method for manufacturing same. According to the image sensor having a 3D structure and the method for manufacturing same of the present invention, by making the size of a bonding pad of a first wafer different from the size of a bonding pad of a second wafer, a process margin can be produced in bonding the first and second wafers, and a constant contact resistance can be maintained by making an inter-pixel contact area uniform.
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