The invention relates to a method for monitoring for wire breaks while hard solids are cut by means of a span of wire, wherein the solid is guided through the span of wire, and a direct current is conducted by the span of wire. The direct current produces a voltage across the span of wire. The voltage is monitored by a sensor, which interrupts the cutting process when a voltage-deviation signal caused by a wire break is received. The invention further relates to a wire saw for carrying out said method and to the use of the method and/or of the wire saw to cut hard, preferably brittle solids, preferably metals and semimetals, preferably mono- and polycrystalline silicon crystals, ceramics, sapphire, and germanium.