Invention Application
- Patent Title: SENSOR MOUNT
- Patent Title (中): 传感器安装
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Application No.: PCT/EP2010/005403Application Date: 2010-09-03
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Publication No.: WO2012028165A1Publication Date: 2012-03-08
- Inventor: DOORNENBAL, Jan
- Applicant: AKTIEBOLAGET SKF , DOORNENBAL, Jan
- Applicant Address: S-415 50 Göteborg SE
- Assignee: AKTIEBOLAGET SKF,DOORNENBAL, Jan
- Current Assignee: AKTIEBOLAGET SKF,DOORNENBAL, Jan
- Current Assignee Address: S-415 50 Göteborg SE
- Agency: BURÖ, Sven Peter
- Main IPC: G01P1/02
- IPC: G01P1/02 ; G01P3/44 ; G01P3/487 ; G01P3/488 ; G01P15/08 ; G01K7/00 ; G01K13/00
Abstract:
The present invention relates to a device for mounting a sensor to a curved component surface. The mounting device (170) has a first side at which the sensor (180) is attached and a second side which has a radius of curvature. Further, the mounting device has an aperture that is shaped to receive an insert part (185) of the sensor, and a first sealing element (191) is provided around the aperture, at the first side of the device. According to the invention, the first sealing element is provided on a first recessed surface of the mounting device, which is defined between a first upstanding rim and a second upstanding rim. The first and second rims extend in a circumferential direction of the device and provide a contact surface for an attachment part (183) of the sensor. In addition, the first and second rims retain the first sealing element in both axial directions.
Information query