Invention Application
WO2012035565A1 SEALING AGENT WITH LOW SOFTENING TEMPERATURE USEFUL IN THE PREPARATION OF ELECTRONIC DEVICES
审中-公开
具有低温度温度的密封剂可用于制备电子设备
- Patent Title: SEALING AGENT WITH LOW SOFTENING TEMPERATURE USEFUL IN THE PREPARATION OF ELECTRONIC DEVICES
- Patent Title (中): 具有低温度温度的密封剂可用于制备电子设备
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Application No.: PCT/IT2010/000394Application Date: 2010-09-16
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Publication No.: WO2012035565A1Publication Date: 2012-03-22
- Inventor: ANTONINI, Alessio
- Applicant: DAUNIA SOLAR CELL S.r.L. , ANTONINI, Alessio
- Applicant Address: S.S. 16 Zona Industriales Incoronata 71100 Foggia IT
- Assignee: DAUNIA SOLAR CELL S.r.L.,ANTONINI, Alessio
- Current Assignee: DAUNIA SOLAR CELL S.r.L.,ANTONINI, Alessio
- Current Assignee Address: S.S. 16 Zona Industriales Incoronata 71100 Foggia IT
- Agency: BOTTI, Mario
- Main IPC: C03C3/066
- IPC: C03C3/066 ; C03C3/068 ; C03C8/04 ; C03C8/08 ; C03C8/14 ; C03C8/16 ; C03C8/20 ; C03C8/24
Abstract:
The invention describes a composition for sealing agent, generally in the form of glass frit, lead-free, comprising by weight over the total weight of the composition: 30-80% Bi2O3; 2- 10% ZnO; 2- 10% B2O3; 0-5% Na2O; 1- 10% SiO2; 1-8% A12O3; 0-7% BaO; and 0-8% MgO. The composition for sealing agent as defined above can be added with a filler in a quantity up to 20% by weight over the total weight of the resulting mixture. It also describes a sealing paste containing the composition for sealing agent, the possible filler, an organic binder and optionally an organic solvent. It also describes methods for producing the composition for sealing agent and the sealing paste.
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