SEALING AGENT WITH LOW SOFTENING TEMPERATURE USEFUL IN THE PREPARATION OF ELECTRONIC DEVICES
    1.
    发明申请
    SEALING AGENT WITH LOW SOFTENING TEMPERATURE USEFUL IN THE PREPARATION OF ELECTRONIC DEVICES 审中-公开
    具有低温度温度的密封剂可用于制备电子设备

    公开(公告)号:WO2012035565A1

    公开(公告)日:2012-03-22

    申请号:PCT/IT2010/000394

    申请日:2010-09-16

    Abstract: The invention describes a composition for sealing agent, generally in the form of glass frit, lead-free, comprising by weight over the total weight of the composition: 30-80% Bi2O3; 2- 10% ZnO; 2- 10% B2O3; 0-5% Na2O; 1- 10% SiO2; 1-8% A12O3; 0-7% BaO; and 0-8% MgO. The composition for sealing agent as defined above can be added with a filler in a quantity up to 20% by weight over the total weight of the resulting mixture. It also describes a sealing paste containing the composition for sealing agent, the possible filler, an organic binder and optionally an organic solvent. It also describes methods for producing the composition for sealing agent and the sealing paste.

    Abstract translation: 本发明描述了一种密封剂的组合物,通常为玻璃料,无铅的组合物,其重量比组合物总重量的重量百分比:30-80%Bi2O3; 2-10%ZnO; 2-10%B2O3; 0-5%Na2O; 1-10%SiO2; 1-8%A12O3; 0-7%BaO; 和0-8%MgO。 如上所述的密封剂组合物可以添加至所得混合物总重量的至多20重量%的填料。 它还描述了一种密封膏,其包含用于密封剂的组合物,可能的填料,有机粘合剂和任选的有机溶剂。 还描述了用于生产密封剂和密封膏的组合物的方法。

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