Invention Application
- Patent Title: STRUCTURE TO REDUCE ELECTROPLATED STABILIZER CONTENT
- Patent Title (中): 降低电极稳定剂含量的结构
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Application No.: PCT/US2011/051568Application Date: 2011-09-14
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Publication No.: WO2012037231A1Publication Date: 2012-03-22
- Inventor: XIE, Yi-Yuan , LENSETH, Kenneth, P. , WATERMAN, Justin , SELVAMANICKAM, Venkat
- Applicant: SUPERPOWER, INC.
- Applicant Address: 450 Duane Avenue Schenectady, New York 12304 US
- Assignee: SUPERPOWER, INC.
- Current Assignee: SUPERPOWER, INC.
- Current Assignee Address: 450 Duane Avenue Schenectady, New York 12304 US
- Agency: ABEL LAW GROUP, LLP et al.
- Priority: US12/882,654 20100915
- Main IPC: H01B12/06
- IPC: H01B12/06 ; H01B12/10
Abstract:
A superconducting article includes first and second stacked conductor segments. The first stacked conductor segment includes first and second superconductive segments and has a nominal thickness tn1. The second stacked conductor segment includes third and forth superconductive segments and has a nominal thickness tn2. The superconducting article further includes a joint region comprising a first splice connecting the first and third superconductive segments together and a second splice connecting the second and forth superconductive segments together. The first splice is adjacent to and bridged portions of the first and third superconductive segments along at least a portion of the joint region, and the second splice is adjacent to and bridged portions of the second and forth superconductive segments along at least a portion of the joint region. The joint region has a thickness tjr, wherein tjr is not greater than at least one of 1.8tn1 and 1.8tn2.
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