Invention Application
WO2012062274A3 POWER SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING A SINTERED POWER SEMICONDUCTOR MODULE HAVING A TEMPERATURE SENSOR
审中-公开
功率半导体模块及其制造方法带温度传感器的烧结功率半导体模块
- Patent Title: POWER SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING A SINTERED POWER SEMICONDUCTOR MODULE HAVING A TEMPERATURE SENSOR
- Patent Title (中): 功率半导体模块及其制造方法带温度传感器的烧结功率半导体模块
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Application No.: PCT/DE2011001905Application Date: 2011-10-28
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Publication No.: WO2012062274A3Publication Date: 2012-07-26
- Inventor: EISELE RONALD
- Applicant: DANFOSS SILICON POWER GMBH , EISELE RONALD
- Assignee: DANFOSS SILICON POWER GMBH,EISELE RONALD
- Current Assignee: DANFOSS SILICON POWER GMBH,EISELE RONALD
- Priority: DE102010050315 2010-11-05
- Main IPC: H01L23/15
- IPC: H01L23/15 ; G01K7/18 ; H01L23/34
Abstract:
The invention relates to a method for producing electrical components that can be sintered, for jointly sintering with active components, wherein the components having a planar shape are provided with at least one flat lower face intended to be sintered, and an electrical contact area on the surface opposite the sintering surface is present in the form of a metal contact surface, which can be contacted at the top face by a common method from the following group: wire bonding or soldering or sintering or pressure contacting, wherein the component is a temperature sensor, on the lower face of which a metallization that can be sintered is provided on a ceramic body and on the ceramic body of which two electrical contact surfaces are provided for continuative electrical connection.
Information query
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