Printed circuit board assembly (2) comprising: - an optical subassembly (4) having a carrying face (14) for carrying at least one optoelectronic component (6) in a such way that light emitted from/directed to is transmitted through the optical subassembly (4); - a printed circuit board (8) having a supporting area (31) for supporting the optical subassembly (4); wherein the printed circuit board supporting area (31) comprises a hole (34) lodging at least one part of the optoelectronic component (6) and wherein at least one part of the carrying face (14) is fixed by flip-chip bonding to at least one part of the supporting area (31).