OPTICAL CIRCUIT BOARD WITH OPTICAL COUPLING DEVICE
    1.
    发明申请
    OPTICAL CIRCUIT BOARD WITH OPTICAL COUPLING DEVICE 审中-公开
    具有光耦合器件的光电路板

    公开(公告)号:WO2011154951A3

    公开(公告)日:2012-08-02

    申请号:PCT/IL2011000456

    申请日:2011-06-09

    Abstract: An optical system comprises: an optical circuit board (1) having an optical layer, comprising an optical waveguide (2) embedded between top and bottom faces, and a cut-out (27) having a bottom reference layer defining an X-Y plane, an optical coupling device having a positioning member (19) extending in the cut-out, a mechanical fixation system (31) attaching the optical circuit board to the optical coupling device, and comprising a fixation pin (32) extending through the optical circuit board at the positioning member (19).

    Abstract translation: 一种光学系统包括:具有光学层的光学电路板(1),包括嵌入在顶面和底面之间的光波导(2)和具有限定XY平面的底部参考层的切口(27), 具有在切口中延伸的定位构件(19)的光耦合装置,将光学电路板连接到光耦合装置的机械固定系统(31),并且包括一个延伸穿过光电路板的固定销(32) 定位构件(19)。

    OPTICAL COUPLING SYSTEM
    2.
    发明申请
    OPTICAL COUPLING SYSTEM 审中-公开
    光耦合系统

    公开(公告)号:WO2012017319A2

    公开(公告)日:2012-02-09

    申请号:PCT/IB2011/002078

    申请日:2011-08-08

    CPC classification number: G02B6/4214 G02B6/4249

    Abstract: The optical coupling system comprises: - a first optical interface (25) comprising a first set of rows; a second optical interface (26) comprising a second set of rows, offset from one another by a second pitch different from the first pitch, - a first and a second light beam forming structure (15, 15') adapted to optically couple the optical interface of an optical circuit board and a mating optical device to the optical coupling system, a reflective arrangement (141, 142, 143) to offset the light transmitted through the optical coupling system.

    Abstract translation: 该光学耦合系统包括: - 第一光学接口(25),其包括第一组行; 包括第二组行的第二光学接口(26),所述第二组行以不同于所述第一节距的第二节距彼此偏移;第一和第二光束形成结构(15,15'),所述第一和第二光束形成结构适于将所述光学 将光学电路板和配合光学装置的接口连接到光学耦合系统;反射装置(141,142,143),用于偏移透过光学耦合系统的光。

    OPTICAL COUPLING SYSTEM
    3.
    发明申请
    OPTICAL COUPLING SYSTEM 审中-公开
    光耦合系统

    公开(公告)号:WO2012017319A3

    公开(公告)日:2012-04-26

    申请号:PCT/IB2011002078

    申请日:2011-08-08

    CPC classification number: G02B6/4214 G02B6/4249

    Abstract: The optical coupling system comprises: - a first optical interface (25) comprising a first set of rows; a second optical interface (26) comprising a second set of rows, offset from one another by a second pitch different from the first pitch, - a first and a second light beam forming structure (15, 15') adapted to optically couple the optical interface of an optical circuit board and a mating optical device to the optical coupling system, a reflective arrangement (141, 142, 143) to offset the light transmitted through the optical coupling system.

    Abstract translation: 该光学耦合系统包括: - 第一光学接口(25),其包括第一组行; 包括第二组行的第二光学接口(26),所述第二组行以不同于所述第一节距的第二节距彼此偏移;第一和第二光束形成结构(15,15'),所述第一和第二光束形成结构适于将所述光学 将光学电路板和配合光学装置的接口连接到光学耦合系统;反射装置(141,142,143),用于偏移透过光学耦合系统的光。

    OPTICAL COUPLING SYSTEM
    4.
    发明申请
    OPTICAL COUPLING SYSTEM 审中-公开
    光耦合系统

    公开(公告)号:WO2012017318A2

    公开(公告)日:2012-02-09

    申请号:PCT/IB2011/002073

    申请日:2011-08-03

    CPC classification number: G02B6/4214 G02B6/3897 G02B6/4206

    Abstract: An optical communication system comprises : _ a daughter optical circuit board (3) having an embedded optical layer (6), - a mother optical circuit board (2), having an embedded optical layer (10), - an optical coupling system having :. a first optical interface (18) optically coupled to a first optical interface of the daughter circuit board, and. a second optical interface (19) optically coupled to a first optical interface of the mother circuit board. The optical coupling system comprises an optical coupling device (17), formed as an integral part of translucent material comprising light beam forming structures (22;27), fixed to the daughter board.

    Abstract translation: 一种光通信系统,包括:具有嵌入式光层(6)的子光电路板(3), - 具有嵌入式光层(10)的母光电路板(2), - 光耦合系统,具有: 。 第一光学接口(18),光学耦合到子电路板的第一光学接口,以及。 第二光接口(19),其光耦合到母电路板的第一光接口。 光耦合系统包括光耦合装置(17),其形成为固定到子板的包括光束形成结构(22; 27)的半透明材料的整体部分。

    OPTICAL COUPLING DEVICE
    6.
    发明申请
    OPTICAL COUPLING DEVICE 审中-公开
    光耦合器件

    公开(公告)号:WO2005121856A1

    公开(公告)日:2005-12-22

    申请号:PCT/EP2005/006098

    申请日:2005-06-07

    CPC classification number: G02B6/30 G02B6/2817 G02B6/3897 G02B6/4214 G02B6/43

    Abstract: The object of the invention is an optical coupling device between at least one waveguide (6) embedded in a printed circuit (3), for conveying an optical beam (F), and an external waveguide (2), the circuit (3) comprising, starting from an exterior surface (4 ) of the circuit, at least one insulating first layer (5) and at least one internal layer incorporating at least one core (1) of embedded waveguide (6) forming said optical path, the device comprising a coupling element (9), positioned in a cut (8), hollowed out in the circuit (3) and cutting the embedded waveguide (6), the coupling element (9) being furnished with means of refocussing of the optical beam between the embedded waveguide (6) and the external waveguide (2) and at least one lower positioning surface (13) on a reference surface (11) of the cut (8) in relation to the axis of the embedded waveguide (6).

    Abstract translation: 本发明的目的是在嵌入印刷电路(3)中的至少一个波导(6),用于输送光束(F)和外部波导(2)之间的光耦合装置,所述电路(3)包括 ,从所述电路的外表面(4)开始,至少一个绝缘的第一层(5)和至少一个内层,其包含形成所述光路的嵌入式波导(6)的至少一个芯(1),所述装置包括 位于电路(3)中挖出并切割嵌入式波导(6)的切口(8)中的耦合元件(9),耦合元件(9)配备有将光束重新聚焦在 嵌入式波导(6)和外部波导(2)以及相对于嵌入式波导(6)的轴线在切割(8)的参考表面(11)上的至少一个下定位表面(13)。

    OPTICAL COUPLING SYSTEM
    8.
    发明申请
    OPTICAL COUPLING SYSTEM 审中-公开
    光耦合系统

    公开(公告)号:WO2012017263A1

    公开(公告)日:2012-02-09

    申请号:PCT/IB2010/002580

    申请日:2010-08-06

    CPC classification number: G02B6/4214 G02B6/4249

    Abstract: The optical coupling system comprises: - a first optical interface (25) comprising a first set of rows; a second optical interface (26) comprising a second set of rows, offset from one another by a second pitch different from the first pitch, - a first and a second light beam forming structure (15, 15') adapted to optically couple the optical interface of an optical circuit board and a mating optical device to the optical coupling system, a reflective arrangement (141, 142, 143) to offset the light transmitted through the optical coupling system.

    Abstract translation: 光耦合系统包括: - 包括第一组行的第一光学接口(25) 第二光学接口(26),包括第二组行,彼此偏移与第一音调不同的第二音调;第一和第二光束形成结构(15,15'),其适于光学地耦合光学 光学电路板和配合光学装置的接口连接到光学耦合系统,反射装置(141,142,143),以偏移透过光耦合系统的光。

    VERY HIGH FREQUENCY ELECTRICAL CONNECTOR
    9.
    发明申请
    VERY HIGH FREQUENCY ELECTRICAL CONNECTOR 审中-公开
    非常高频的电气连接器

    公开(公告)号:WO2006002925A8

    公开(公告)日:2010-08-05

    申请号:PCT/EP2005007059

    申请日:2005-06-30

    Abstract: The invention concerns an electrical connector (1) comprising a box (2), at least one electrically conductive track (7, 9, 10, 11) and a plurality of first electrical contacts (8), the first contacts being designed to come into contact with complementary second electrical contacts (20) of a complementary connection device (5). In order to reduce the manufacturing cost of such an electrical connector and increase the electronic data transfer capacity through this electrical connector, the invention provides that the first electrical contacts are connected to electrically conductive tracks by joining, and that the box is formed by at least one molded plastic that is at least partially metal-coated to form the electrically conductive tracks.

    Abstract translation: 本发明涉及一种包括盒(2),至少一个导电轨道(7,9,10,11)和多个第一电触点(8)的电连接器(1),所述第一触点被设计成进入 与互补连接装置(5)的互补的第二电触头(20)接触。 为了降低这种电连接器的制造成本并且通过该电连接器增加电子数据传输能力,本发明提供了第一电触头通过接合连接到导电轨道,并且该盒至少形成 一个模制塑料,其至少部分金属涂覆以形成导电轨道。

    CRIMPING METHOD AND DEVICE MANUFACTURED THEREBY
    10.
    发明申请
    CRIMPING METHOD AND DEVICE MANUFACTURED THEREBY 审中-公开
    制造方法和制造的装置

    公开(公告)号:WO2007068280A1

    公开(公告)日:2007-06-21

    申请号:PCT/EP2005/014221

    申请日:2005-12-16

    CPC classification number: H01R12/68 H01R2201/02

    Abstract: A method for crimping two thin elements together, while connecting ther electrically, comprising the step of: a) providing a dielectric substrate (5) with a conductive layer; b) providing a metallic strap with at least one work hardened piercing toot) (10a, 10b, 10c, 10d, 10'a, 10'b, 10'c, 10'd); c) piercing both the dielectric substrate and the conductive layer with the at least one piercing tooth; and d) bending the at least one piercing tooth on the conductive layer so as tc clamp at least the conductive layer and the dielectric substrate between the a least one piercing tooth and the metallic strap. A device manufactured with such a method.

    Abstract translation: 一种用于将两个薄元件压接在一起的方法,同时电连接,包括以下步骤:a)提供具有导电层的电介质基板(5); (10a,10b,10c,10d,10'a,10'b,10'c,10'd)提供具有至少一个加工硬化的穿刺齿的金属带; c)用所述至少一个刺穿齿刺穿所述电介质基底和所述导电层; 以及d)在所述导电层上弯曲所述至少一个穿孔齿,以便至少将所述导电层和所述电介质基底夹紧在所述至少一个刺穿齿与所述金属带之间。 用这种方法制造的装置。

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