An integrated circuit is formed of a plurality of circuit dies 22, 24 having through silicon vias (TSVs) passing there-through. The placement patterns of the through silicon vias differ between the circuit dies. An inter-die routing layer is provided either in a face of a substrate of one of the circuit dies or in an outer face of a layer of processing circuitry of one of the circuit dies. The inter-die routing layer bridges the gaps between the vias and the connection points of different circuit dies. The inter-die routing layer may be formed of metal tracks.