Invention Application
- Patent Title: PRINTED CIRCUIT BOARD ASSEMBLY
- Patent Title (中): 印刷电路板组装
-
Application No.: PCT/IB2012/050408Application Date: 2012-01-30
-
Publication No.: WO2012101611A1Publication Date: 2012-08-02
- Inventor: JI, Hangfeng , BALKENENDE, Abraham, Rudolf , CHEN, Hong
- Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V. , JI, Hangfeng , BALKENENDE, Abraham, Rudolf , CHEN, Hong
- Applicant Address: Groenewoudseweg 1 NL-5621 BA Eindhoven NL
- Assignee: KONINKLIJKE PHILIPS ELECTRONICS N.V.,JI, Hangfeng,BALKENENDE, Abraham, Rudolf,CHEN, Hong
- Current Assignee: KONINKLIJKE PHILIPS ELECTRONICS N.V.,JI, Hangfeng,BALKENENDE, Abraham, Rudolf,CHEN, Hong
- Current Assignee Address: Groenewoudseweg 1 NL-5621 BA Eindhoven NL
- Agency: EEUWIJK, Alexander et al.
- Priority: CNPCT/CN2011/070824 20110130
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/22 ; H05K3/30 ; H05K3/32 ; H05K3/34
Abstract:
The present invention relates to a printed circuit board assembly (10), said printed circuit board assembly comprising: a substrate (100); two or more electronic components which are categorized, wherein each component is secured to the substrate by securing means having a different predetermined thermal-release temperature, depending on which category said component belongs to. The invention furthermore relates to a method of assembling the printed circuit board assembly and a method of disassembling the printed circuit board assembly according to the invention.
Information query
