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Invention Application
WO2013013204A3 COMPLIANT INTERCONNECT PILLARS WITH ORIENTATION OR GEOMETRY DEPENDENT ON THE POSITION ON A DIE OR FORMED WITH A PATTERNED STRUCTURE BETWEEN THE PILLAR AND A DIE PAD FOR REDUCTION OF THERMAL STRESS 审中-公开
依靠立方或几何关系的连接或几何依赖于在用于减少热应力的支柱和用于衬垫之间的图案结构形成的位置上的位置或几何

COMPLIANT INTERCONNECT PILLARS WITH ORIENTATION OR GEOMETRY DEPENDENT ON THE POSITION ON A DIE OR FORMED WITH A PATTERNED STRUCTURE BETWEEN THE PILLAR AND A DIE PAD FOR REDUCTION OF THERMAL STRESS
Abstract:
Pillars (300, 306, 502) having a directed compliance geometry are arranged to couple a semiconductor die (400, 500) to a substrate. The direction of maximum compliance of each pillar (300, 306, 502) may be aligned with the direction of maximum stress caused by unequal thermal expansion and contraction of the semiconductor die (400, 500) and the substrate. Pillars (300, 306, 502) may be designed and constructed with various shapes having particular compliance characteristics and particular directions (302, 304, 308, 310, 504) of maximum compliance. The shape and orientation of the pillars (300, 306, 502) may be selected as a function of their location on a die (400, 500) to accommodate the direction and magnitude of stress at their location. Pillars (610) may also be fabricated with particular shapes by patterning a material (604) such as a passivation material on a pad on a die (600) to increase the surface area upon which the pillar (610) is plated or deposited.
Abstract(Chinese):

布置具有定向柔性几何形状的支柱（300,306,502）以将半导体管芯（400,500）耦合到衬底。 每个支柱（300,306,502）的最大顺应性的方向可以与由半导体管芯（400,500）和衬底的不相等的热膨胀和收缩引起的最大应力的方向对齐。 支柱（300,306,502）可以被设计和构造成具有特定柔量特性的各种形状和具有最大顺从性的特定方向（302,304,308,304,504）。 可以选择支柱（300,306,502）的形状和取向作为其在模具（400,500）上的位置的函数，以适应其位置处的应力的方向和大小。 也可以通过在模具（600）上的垫上图案化诸如钝化材料的材料（604）以增加柱（610）被镀或沉积的表面积，来制造具有特定形状的支柱（610）。

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