公开(公告)号：WO2013013204A3

公开(公告)日：2013-03-14

申请号：PCT/US2012047722

申请日：2012-07-20

申请人： QUALCOMM INC ,  BAO ZHONGPING ,  BURRELL JAMES D ,  GU SHIQUN

发明人： BAO ZHONGPING ,  BURRELL JAMES D ,  GU SHIQUN

IPC分类号： H01L23/485 ,  H01L21/60

CPC分类号： H01L24/14 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/05011 ,  H01L2224/05015 ,  H01L2224/05017 ,  H01L2224/05558 ,  H01L2224/056 ,  H01L2224/1146 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14142 ,  H01L2224/16057 ,  H01L2224/17051 ,  H01L2224/81211 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00014

摘要： Pillars (300, 306, 502) having a directed compliance geometry are arranged to couple a semiconductor die (400, 500) to a substrate. The direction of maximum compliance of each pillar (300, 306, 502) may be aligned with the direction of maximum stress caused by unequal thermal expansion and contraction of the semiconductor die (400, 500) and the substrate. Pillars (300, 306, 502) may be designed and constructed with various shapes having particular compliance characteristics and particular directions (302, 304, 308, 310, 504) of maximum compliance. The shape and orientation of the pillars (300, 306, 502) may be selected as a function of their location on a die (400, 500) to accommodate the direction and magnitude of stress at their location. Pillars (610) may also be fabricated with particular shapes by patterning a material (604) such as a passivation material on a pad on a die (600) to increase the surface area upon which the pillar (610) is plated or deposited.

摘要翻译： 布置具有定向柔性几何形状的支柱（300,306,502）以将半导体管芯（400,500）耦合到衬底。 每个支柱（300,306,502）的最大顺应性的方向可以与由半导体管芯（400,500）和衬底的不相等的热膨胀和收缩引起的最大应力的方向对齐。 支柱（300,306,502）可以被设计和构造成具有特定柔量特性的各种形状和具有最大顺从性的特定方向（302,304,308,304,504）。 可以选择支柱（300,306,502）的形状和取向作为其在模具（400,500）上的位置的函数，以适应其位置处的应力的方向和大小。 也可以通过在模具（600）上的垫上图案化诸如钝化材料的材料（604）以增加柱（610）被镀或沉积的表面积，来制造具有特定形状的支柱（610）。

公开(公告)号：WO2013052266A3

公开(公告)日：2013-07-18

申请号：PCT/US2012055761

申请日：2012-09-17

申请人： QUALCOMM INC ,  ANDERSON JON J ,  GOOD GARY D ,  BURRELL JAMES D

发明人： ANDERSON JON J ,  GOOD GARY D ,  BURRELL JAMES D

IPC分类号： G06F1/20

CPC分类号： G06F1/203 ,  G06F1/206 ,  G06F1/3231 ,  Y02D10/16

摘要： Various embodiments of methods and systems for leveraging a user proximity measurement to determine thermal management policies in a portable computing device ("PCD") are disclosed. By leveraging the proximity measurement to set temperature thresholds, the quality of service ("QoS") provided by the PCD can be optimized when touch temperature of the PCD is not a significant factor for user experience. One such method involves monitoring a proximity signal to determine relative physical proximity of the PCD to a user. Based on the user proximity, a temperature threshold associated with a temperature sensor may be set and compared with an actual temperature measurement received from the temperature sensor. Based on the comparison, thermal management policies in the PCD can be evaluated. For instance, if the temperature threshold is higher than the actual measurement, PCD components may be allowed to increase power consumption, even though PCD temperature may rise, thereby optimizing QoS.

摘要翻译： 公开了用于利用用户接近度测量来确定便携式计算设备（“PCD”）中的热管理策略的方法和系统的各种实施例。 通过利用接近度测量来设置温度阈值，PCD提供的服务质量（“QoS”）可以在PCD的触摸温度不是用户体验的重要因素时被优化。 一种这样的方法涉及监测接近信号以确定PCD对用户的相对物理接近度。 基于用户接近度，可以设置与温度传感器相关联的温度阈值并将其与从温度传感器接收到的实际温度测量值进行比较。 根据比较，可以评估PCD中的热管理策略。 例如，如果温度阈值高于实际测量值，即使PCD温度可能上升，PCD组件也可能被允许增加功耗，从而优化QoS。

公开(公告)号：WO2013052266A2

公开(公告)日：2013-04-11

申请号：PCT/US2012/055761

申请日：2012-09-17

申请人： QUALCOMM INCORPORATED ,  ANDERSON, Jon J. ,  GOOD, Gary D. ,  BURRELL, James D.

发明人： ANDERSON, Jon J. ,  GOOD, Gary D. ,  BURRELL, James D.

IPC分类号： G06F1/20

CPC分类号： G06F1/203 ,  G06F1/206 ,  G06F1/3231 ,  Y02D10/16

摘要： Various embodiments of methods and systems for leveraging a user proximity measurement to determine thermal management policies in a portable computing device ("PCD") are disclosed. By leveraging the proximity measurement to set temperature thresholds, the quality of service ("QoS") provided by the PCD can be optimized when touch temperature of the PCD is not a significant factor for user experience. One such method involves monitoring a proximity signal to determine relative physical proximity of the PCD to a user. Based on the user proximity, a temperature threshold associated with a temperature sensor may be set and compared with an actual temperature measurement received from the temperature sensor. Based on the comparison, thermal management policies in the PCD can be evaluated. For instance, if the temperature threshold is higher than the actual measurement, PCD components may be allowed to increase power consumption, even though PCD temperature may rise, thereby optimizing QoS.

摘要翻译： 公开了用于利用用户接近度测量来确定便携式计算设备（“PCD”）中的热管理策略的方法和系统的各种实施例。 通过利用接近度测量来设置温度阈值，当PCD的触摸温度不是用户体验的重要因素时，可以优化由PCD提供的服务质量（“QoS”）。 一种这样的方法涉及监视接近信号以确定PCD与用户的相对物理接近度。 基于用户接近度，可以设置与温度传感器相关联的温度阈值并将其与从温度传感器接收的实际温度测量值进行比较。 根据比较，可以评估PCD中的热管理策略。 例如，如果温度阈值高于实际测量值，即使PCD温度升高，也可允许PCD组件增加功耗，从而优化QoS。

公开(公告)号：WO2013013204A2

公开(公告)日：2013-01-24

申请号：PCT/US2012/047722

申请日：2012-07-20

申请人： QUALCOMM Incorporated ,  BAO, Zhongping ,  BURRELL, James D. ,  GU, Shiqun

发明人： BAO, Zhongping ,  BURRELL, James D. ,  GU, Shiqun

IPC分类号： H01L23/485

CPC分类号： H01L24/14 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/05011 ,  H01L2224/05015 ,  H01L2224/05017 ,  H01L2224/05558 ,  H01L2224/056 ,  H01L2224/1146 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/141 ,  H01L2224/14142 ,  H01L2224/16057 ,  H01L2224/17051 ,  H01L2224/81211 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Pillars having a directed compliance geometry are arranged to couple a semiconductor die to a substrate. The direction of maximum compliance of each pillar may be aligned with the direction of maximum stress caused by unequal thermal expansion and contraction of the semiconductor die and substrate. Pillars may be designed and constructed with various shapes having particular compliance characteristics and particular directions of maximum compliance. The shape and orientation of the pillars may be selected as a function of their location on a die to accommodate the direction and magnitude of stress at their location. A method includes fabricating pillars with particular shapes by patterning to increase surface of materials upon which the pillar is plated or deposited.

摘要翻译： 具有定向柔性几何形状的支柱布置成将半导体管芯耦合到衬底。 每个支柱的最大顺应性的方向可以与由半导体管芯和衬底的不等的热膨胀和收缩引起的最大应力的方向一致。 支柱可以被设计和构造成各种形状，具有特定的顺应特性和最大顺应性的特定方向。 可以选择支柱的形状和取向作为它们在模具上的位置的函数，以适应其位置处的应力的方向和大小。 一种方法包括通过图案化来制造具有特定形状的柱，以增加柱被镀或沉积的材料的表面。