Invention Application
- Patent Title: METAL CLAD CIRCUIT BOARD
- Patent Title (中): 金属电路板
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Application No.: PCT/US2012/050834Application Date: 2012-08-15
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Publication No.: WO2013028418A1Publication Date: 2013-02-28
- Inventor: MOSTOLLER, Matthew Edward , RIX, Robert David , LAUB, Michael Fredrick , MYERS, Majorie Kay , PERRONNE, Dean, P. , MORALES, Miguel, A. , MALSTROM, Charles Randall , RADZILOWSKI, Leonard Henry
- Applicant: TYCO ELECTRONICS CORPORATION , MOSTOLLER, Matthew Edward , RIX, Robert David , LAUB, Michael Fredrick , MYERS, Majorie Kay , PERRONNE, Dean, P. , MORALES, Miguel, A. , MALSTROM, Charles Randall , RADZILOWSKI, Leonard Henry
- Applicant Address: 1050 Westlakes Drive Berwyn, Pennsylvania 19312 US
- Assignee: TYCO ELECTRONICS CORPORATION,MOSTOLLER, Matthew Edward,RIX, Robert David,LAUB, Michael Fredrick,MYERS, Majorie Kay,PERRONNE, Dean, P.,MORALES, Miguel, A.,MALSTROM, Charles Randall,RADZILOWSKI, Leonard Henry
- Current Assignee: TYCO ELECTRONICS CORPORATION,MOSTOLLER, Matthew Edward,RIX, Robert David,LAUB, Michael Fredrick,MYERS, Majorie Kay,PERRONNE, Dean, P.,MORALES, Miguel, A.,MALSTROM, Charles Randall,RADZILOWSKI, Leonard Henry
- Current Assignee Address: 1050 Westlakes Drive Berwyn, Pennsylvania 19312 US
- Agency: STROUD, Adam, L. et al.
- Priority: US13/215,947 20110823
- Main IPC: H05K1/05
- IPC: H05K1/05 ; H05K3/18 ; H05K3/00 ; H05K3/44
Abstract:
A metal clad circuit board (102) includes a metal substrate (120). A dielectric layer (122) is applied to the metal substrate. A conductive seed layer (124) is printed on the dielectric layer. A conductive circuit layer (126) is plated onto the conductive seed layer. Optionally, the conductive seed layer may be inkjet printed on the dielectric layer. Alternatively, the conductive seed layer may be pad printed on the dielectric layer. Optionally, the dielectric layer may be powder coated to the metal substrate. The dielectric layer may include polymers and fillers compression molded to the metal substrate. Optionally, the conductive circuit layer may be electroplated to the conductive seed layer. Optionally, a solder mask (128) may be applied over the conductive circuit layer.
Information query
