An apparatus and method for the evaporation and deposition of materials onto a substrate. A material hopper assembly may receive source material. An agitator mechanism may be controlled for urging or advancing forward the source material. A grinding mechanism may be controlled for grinding source material. A heating pot vessel may be heated to evaporate the source material. The evaporated source material may be deposited on a proximate substrate. The rate of the deposition may be controlled in part by the agitator mechanism and/or the grinding mechanism. Temperature zones in a heating pot vessel may be independently controlled to evaporate the source material. A reactor chamber may be heated to allow the evaporated source materials to interact. A heated mesh may be charged to accelerate particles of the evaporated source materials onto the substrate.