Abstract:
A rotating magnetron sputtering cathode apparatus comprising a radio frequency power supply, a power delivery assembly, a cylindrical rotating cathode, a shaft and a drive motor, wherein the power delivery assembly comprises a magnetic field source positioned within the cathode and an electrode extending within said cathode to transmit radio frequency energy to target material on the outer surface of the cathode. The electrode is electrically isolated from the shaft, and is formed from non-ferrous materials, and the shaft is mechanically connected to the cathode such that they remain electrically isolated while the cathode rotates about the magnetic field source and a portion of the electrode. The power supply is adapted to supply radio frequency energy at frequencies of 1 MHz or higher and is electrically connected to the electrode. A method of depositing material with a rotating cylindrical magnetron sputtering cathode apparatus comprising a radio frequency power supply and a cylindrical rotating cathode is also disclosed wherein the outer surface of the rotating cathode comprises a target material formed of an oxide. The method comprises the steps of causing the power supply to supply radio frequency energy at frequencies of 1 MHz or higher, causing the cathode to rotate, and positioning a substrate proximate to said outside surface of said cathode whereby the radio frequency energy causes the cathode to eject particles from the target material onto the substrate.
Abstract:
A smart material actuator having a fixed supporting member, mechanical web, actuating arm, and piezoelectric or smart material stack is disclosed, together with a sensor adapted to indicate the degree of motion of the actuating arms and controller adapted to allow safe operation of the actuator in resonant conditions. Methods of maintaining resonant operation, avoiding resonant operation, and adjusting resonant frequencies are also disclosed.
Abstract:
An apparatus and method for the evaporation and deposition of materials onto a substrate. A material hopper assembly may receive source material. An agitator mechanism may be controlled for urging or advancing forward the source material. A grinding mechanism may be controlled for grinding source material. A heating pot vessel may be heated to evaporate the source material. The evaporated source material may be deposited on a proximate substrate. The rate of the deposition may be controlled in part by the agitator mechanism and/or the grinding mechanism. Temperature zones in a heating pot vessel may be independently controlled to evaporate the source material. A reactor chamber may be heated to allow the evaporated source materials to interact. A heated mesh may be charged to accelerate particles of the evaporated source materials onto the substrate.
Abstract:
A rotating magnetron sputtering cathode apparatus comprising a radio frequency power supply, a power delivery assembly, a cylindrical rotating cathode, a shaft and a drive motor, wherein the power delivery assembly comprises a magnetic field source positioned within the cathode and an electrode extending within said cathode to transmit radio frequency energy to target material on the outer surface of the cathode. The electrode is electrically isolated from the shaft, and is formed from non-ferrous materials, and the shaft is mechanically connected to the cathode such that they remain electrically isolated while the cathode rotates about the magnetic field source and a portion of the electrode. The power supply is adapted to supply radio frequency energy at frequencies of 1 MHz or higher and is electrically connected to the electrode. A method of depositing material with a rotating cylindrical magnetron sputtering cathode apparatus comprising a radio frequency power supply and a cylindrical rotating cathode is also disclosed wherein the outer surface of the rotating cathode comprises a target material formed of an oxide. The method comprises the steps of causing the power supply to supply radio frequency energy at frequencies of 1 MHz or higher, causing the cathode to rotate, and positioning a substrate proximate to said outside surface of said cathode whereby the radio frequency energy causes the cathode to eject particles from the target material onto the substrate.
Abstract:
An apparatus and method for the evaporation and deposition of materials onto a substrate. A material hopper assembly may receive source material. An agitator mechanism may be controlled for urging or advancing forward the source material. A grinding mechanism may be controlled for grinding source material. A heating pot vessel may be heated to evaporate the source material. The evaporated source material may be deposited on a proximate substrate. The rate of the deposition may be controlled in part by the agitator mechanism and/or the grinding mechanism. Temperature zones in a heating pot vessel may be independently controlled to evaporate the source material. A reactor chamber may be heated to allow the evaporated source materials to interact. A heated mesh may be charged to accelerate particles of the evaporated source materials onto the substrate.
Abstract:
An apparatus (10) having a support structure (12) with at least one surface for movement by a smart material actuator (32), such as a piezoelectric actuator, in which the actuator can be protected from humidity, moisture, and/or other harmful substances by, for example, a continuous layer of a barrier compound contacting the support structure and coating the actuator, or at least one film affixed to the support structure for enclosing the actuator, or both. Methods for the protection of an actuator are provided.
Abstract:
A smart material actuator having a fixed supporting member, mechanical web, actuating arm, and piezoelectric or smart material stack is disclosed, together with a sensor adapted to indicate the degree of motion of the actuating arms and controller adapted to allow safe operation of the actuator in resonant conditions. Methods of maintaining resonant operation, avoiding resonant operation, and adjusting resonant frequencies are also disclosed.