Invention Application
WO2013039243A1 PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE
审中-公开
图案形成方法，电子束敏感或极端超紫外线辐射敏感性树脂组合物，电阻膜，使用其和电子器件的电子器件的制造方法
- Patent Title: PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE
- Patent Title (中): 图案形成方法，电子束敏感或极端超紫外线辐射敏感性树脂组合物，电阻膜，使用其和电子器件的电子器件的制造方法
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Application No.: PCT/JP2012/073765Application Date: 2012-09-11
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Publication No.: WO2013039243A1Publication Date: 2013-03-21
- Inventor: TAKIZAWA, Hiroo , TSUBAKI, Hideaki , HIRANO, Shuji
- Applicant: FUJIFILM Corporation , TAKIZAWA, Hiroo , TSUBAKI, Hideaki , HIRANO, Shuji
- Applicant Address: 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1060031 JP
- Assignee: FUJIFILM Corporation,TAKIZAWA, Hiroo,TSUBAKI, Hideaki,HIRANO, Shuji
- Current Assignee: FUJIFILM Corporation,TAKIZAWA, Hiroo,TSUBAKI, Hideaki,HIRANO, Shuji
- Current Assignee Address: 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1060031 JP
- Agency: TAKAMATSU, Takeshi et al.
- Priority: JP2011-202044 20110915; US61/535,024 20110915
- Main IPC: G03F7/038
- IPC: G03F7/038 ; C08F212/14 ; C08F220/10 ; G03F7/004 ; G03F7/039 ; H01L21/027
Abstract:
A pattern-forming method includes in this order: step (1) of forming a film with an electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition that contains (A) a resin having an acid-decomposable repeating unit and capable of decreasing a solubility of the resin (A) in a developer containing an organic solvent by an action of an acid, (B) a compound capable of generating an acid upon irradiation with an electron beam or extreme ultraviolet radiation and (C) a solvent; step (2) of exposing the film with an electron beam or extreme ultraviolet radiation; and step (4) of forming a negative pattern by development of the film with a developer containing an organic solvent after the exposing of the film, wherein a content of the compound (B) is 21% by mass to 70% by mass on the basis of all solids content of the composition.
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