Abstract:
An organ resection tool has a first conductor configured to apply microwaves, a second conductor configured to receive the microwaves, an insulator with which at least one of the first conductor and the second conductor is partially or entirely covered, and a brush structure connected directly or indirectly to the insulator or to at least one of the first conductor and the second conductor.
Abstract:
A heating apparatus and a heating method are provided. The heating apparatus includes a coil configured to receive AC power to form a magnetic field that inductively heats a workpiece, a spray unit configured to spray cooling fluid including a liquid to the coil in a form of mist at least during a period in which the AC power is supplied to the coil. Alternatively, the spray unit may be configured to spray the cooling fluid in the form of mist to a heating target portion of the workpiece placed in the magnetic field at least during the period in which the AC power is supplied to the coil.
Abstract:
To heat a workpiece having a recess portion provided along a longitudinal axis of the workpiece, the workpiece is inserted into an induction heating coil, and the induction heating coil or the workpiece is along an axial direction of the workpiece. The induction heating coil has a conductor configured to surround the workpiece around the axis of the workpiece. The conductor has a protruding portion protruding inwardly to face the recess portion of the workpiece.
Abstract:
A rack manufacturing apparatus (100) and a rack manufacturing method are provided. The rack manufacturing apparatus includes a first support portion (110) configured to support a hollow or solid first bar (12A) on which first rack teeth are formed, a second support portion (140) configured to support a hollow or solid second bar (12B) such that an axial center line of the second bar (C2) is aligned with an axial center line of the first bar (C1), a base (20) configured to cause the second support portion (140) to approach the first support portion (110), and a rotary driving portion (130) configured to rotate the second support portion (140) about the axial center line of the second support portion (C2) relative to the first support portion (110) so as to join an end portion of the first bar (12A) and an end portion of the second bar (12B) by a friction pressure welding.
Abstract:
There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising: (A) a resin having a repeating unit represented by the specific formula and a group capable of decomposing by an action of an acid to produce a polar group; and an ionic compound represented by the specific formula, and a resist film comprising the actinic ray-sensitive or radiation-sensitive resin composition.
Abstract:
There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising: (A) a resin containing a repeating unit represented by the first specific formula and a repeating unit represented by the second specific formula, wherein the content of the repeating unit represented by the first specific formula is 35 mol% or more based on all repeating units in the resin (A), a resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition.
Abstract:
There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising (P) a resin containing a repeating unit represented by the specific formula (1) and a repeating unit represented by the specific formula (A); a resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition; a pattern forming method comprising (i) a step of forming a film from the actinic ray-sensitive or radiation-sensitive resin composition, (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using a developer to form a pattern; a method for manufacturing an electronic device, comprising the pattern forming method, and an electronic device manufactured by the manufacturing method of an electronic device.
Abstract:
There is provided an actinic ray-sensitive or radiation-sensitive resin composition including: (A) a resin having a repeating unit having a group capable of decomposing by the action of an acid to generate a polar group; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; and (C) a component containing at least one of: a compound having at least one of a fluorine atom and a silicon atom and having basicity or capable of increasing the basicity by the action of an acid, and a resin having a CH3 partial structure in a side chain moiety and having a basicity or capable of increasing the basicity by the action of an acid, wherein a content of the repeating unit having a group capable of decomposing by the action of an acid to generate a polar group is 55% by mole or more based on a whole repeating units of the resin (A).
Abstract:
A pattern forming method includes: (i) a step of forming a first film by using an actinic ray-sensitive or radiation-sensitive resin composition (I), (ii) a step of exposing the first film, (iii) a step of developing the exposed first film by using an organic solvent-containing developer to form a negative pattern, (iv) a step of forming a second film on the negative pattern by using a specific composition (II), (v) a step of increasing polarity of the specific compound compound present in the second film, and (vi) a step of removing a specific area of the second film by using the organic solvent-containing remover.
Abstract:
There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising (P) a resin having a repeating unit (A) represented by the specific formula (I) capable of generating an acid on the side chain of the resin upon irradiation with an actinic ray or radiation, and a resist film formed with the actinic ray-sensitive or radiation-sensitive resin composition, and a pattern forming method comprising: exposing the resist film, and developing the exposed resist film, and a method for manufacturing a semiconductor device, containing the pattern forming method, and a semiconductor device manufactured by the manufacturing method of the semiconductor device.