Invention Application
WO2013103600A4 EXTRUSION-BASED ADDITIVE MANUFACTURING SYSTEM FOR 3D STRUCTURAL ELECTRONIC, ELECTROMAGNETIC AND ELECTROMECHANICAL COMPONENTS/DEVICES
审中-公开
用于3D结构电子，电磁和电子元件/器件的基于挤出的添加剂制造系统
- Patent Title: EXTRUSION-BASED ADDITIVE MANUFACTURING SYSTEM FOR 3D STRUCTURAL ELECTRONIC, ELECTROMAGNETIC AND ELECTROMECHANICAL COMPONENTS/DEVICES
- Patent Title (中): 用于3D结构电子，电磁和电子元件/器件的基于挤出的添加剂制造系统
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Application No.: PCT/US2012072100Application Date: 2012-12-28
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Publication No.: WO2013103600A4Publication Date: 2013-08-08
- Inventor: WICKER RYAN B , MACDONALD ERIC , MEDINA FRANCISCO , ESPALIN DAVID , MUSE DANNY W
- Applicant: UNIV TEXAS
- Assignee: UNIV TEXAS
- Current Assignee: UNIV TEXAS
- Priority: US201213343651 2012-01-04
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L21/768
Abstract:
The present invention provides a system and method for making a three-dimensional electronic, electromagnetic or electromechanical component/device by: (1) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by- layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities; (2) filling the interconnection cavities with a conductive material; and (3) placing one or more components in the component cavities.
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