Invention Application
- Patent Title: ISOTROPIC CONDUCTIVE ADHESIVE
- Patent Title (中): 等电导体粘合剂
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Application No.: PCT/EP2013/061091Application Date: 2013-05-29
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Publication No.: WO2013178692A1Publication Date: 2013-12-05
- Inventor: KRISTIANSEN, Helge , REDFORD, Keith , HELLAND, Tore
- Applicant: CONPART AS
- Applicant Address: Dragonveien 54 N-2013 Skjetten NO
- Assignee: CONPART AS
- Current Assignee: CONPART AS
- Current Assignee Address: Dragonveien 54 N-2013 Skjetten NO
- Agency: TAYLOR, Adam
- Priority: GB1209486.8 20120529; US61/652,524 20120529; GB1304532.3 20130313
- Main IPC: C09J9/02
- IPC: C09J9/02 ; H01B1/22 ; H01R4/04
Abstract:
An isotropic conductive adhesive comprises silver coated polymer beads 12 within an adhesive matrix 8, wherein the mean average diameter of the polymer cores of the beads 12 is 5 µm or greater and less than 30 µm, and wherein the silver coating comprises interlinked silver deposits grown from dispersed nucleation sites scattered across the surface of the beads.
Information query
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