IMPROVEMENTS IN CONDUCTIVE ADHESIVES
    1.
    发明申请

    公开(公告)号:WO2014009552A3

    公开(公告)日:2014-01-16

    申请号:PCT/EP2013/064838

    申请日:2013-07-12

    Applicant: CONPART AS

    Abstract: A conductive adhesive, such as an anisotropic conductive adhesive, comprising a population of conductive particles and a population of signal particles in an adhesive; wherein both the conductive particle population and the signal particle population have an average particle diameter of

    SPACER PARTICLES FOR ADHESIVES
    2.
    发明申请
    SPACER PARTICLES FOR ADHESIVES 审中-公开
    粘合剂的间隔颗粒

    公开(公告)号:WO2017060528A1

    公开(公告)日:2017-04-13

    申请号:PCT/EP2016/074228

    申请日:2016-10-10

    Applicant: CONPART AS

    CPC classification number: C09J9/02 C09J175/04 C09J2205/102

    Abstract: A particle 10 for use in a conductive adhesive 20 is provided. The particle 10 comprises a core1having a core diameter. The core is formed of a first material having a first elastic modulus. The particle 10 further comprises a shell 2 around the core 1 which is formed of a second material having a second elastic modulus. The core diameter is greater than or equal to 50% of the particle diameter. The first elastic modulus is greater than the second elastic modulus.

    Abstract translation: 提供用于导电粘合剂20的颗粒10。 颗粒10包括具有芯直径的芯。 芯由具有第一弹性模量的第一材料形成。 颗粒10还包括围绕芯1的壳体2,壳体2由具有第二弹性模量的第二材料形成。 芯直径大于或等于粒径的50%。 第一弹性模量大于第二弹性模量。

    ISOTROPIC CONDUCTIVE ADHESIVE
    6.
    发明申请
    ISOTROPIC CONDUCTIVE ADHESIVE 审中-公开
    等电导体粘合剂

    公开(公告)号:WO2013178692A1

    公开(公告)日:2013-12-05

    申请号:PCT/EP2013/061091

    申请日:2013-05-29

    Applicant: CONPART AS

    Abstract: An isotropic conductive adhesive comprises silver coated polymer beads 12 within an adhesive matrix 8, wherein the mean average diameter of the polymer cores of the beads 12 is 5 µm or greater and less than 30 µm, and wherein the silver coating comprises interlinked silver deposits grown from dispersed nucleation sites scattered across the surface of the beads.

    Abstract translation: 各向同性导电粘合剂包括粘合剂基体8内的银涂覆的聚合物珠粒12,其中珠粒12的聚合物芯的平均平均直径为5μm以上且小于30μm,并且其中银涂层包含生长的互连银沉积物 从分散的成核位点分散在珠的表面。

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