Invention Application
WO2014003779A1 A FLEXIBLE PRINTED CIRCUIT AND A METHOD OF FABRICATING A FLEXIBLE PRINTED CIRCUIT
审中-公开
柔性印刷电路和制造柔性印刷电路的方法
- Patent Title: A FLEXIBLE PRINTED CIRCUIT AND A METHOD OF FABRICATING A FLEXIBLE PRINTED CIRCUIT
- Patent Title (中): 柔性印刷电路和制造柔性印刷电路的方法
-
Application No.: PCT/US2012/044855Application Date: 2012-06-29
-
Publication No.: WO2014003779A1Publication Date: 2014-01-03
- Inventor: FOO, Siang Sin , HOW, Choong Meng
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY , FOO, Siang Sin , HOW, Choong Meng
- Applicant Address: 3M Center Post Office Box 33427 Saint Paul, Minnesota 55133-3427 US
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY,FOO, Siang Sin,HOW, Choong Meng
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY,FOO, Siang Sin,HOW, Choong Meng
- Current Assignee Address: 3M Center Post Office Box 33427 Saint Paul, Minnesota 55133-3427 US
- Agency: GOVER, Melanie G., et al.
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K3/38
Abstract:
Various embodiments provide a flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion. The electrically-conductive layer portion may be superimposed over the substrate layer portion. The substrate layer portion may have an opening formed therein and part of the electrically-conductive layer portion may be positioned over the opening to form a partially detachable tab. The tab may be for use in initiating separation of one portion of the flexible printed circuit from another portion of the flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a plurality of electronic devices.
Information query