Various aspects of an approach for routing die signals in an interior portion of a die (152) using external interconnects (202+222+212) are described herein. The approach provides for contacts (102, 112) coupled to circuits in the interior portion of the die (152), where the contacts (102, 112) are exposed to an exterior portion of the die (152). The external interconnects (202+222+212) are configured to couple these contacts (102, 112) so that signals from the circuits in the interior portion of the die (152) may be routed externally to the die (152) to reinsert them back into the die (152). In various aspects of the disclosed approach, the external interconnects (202+222+212) are protected by a packaging (252) for the die (152). A testing circuit configured to couple the circuits during a testing mode may be foreseen in the interior portion of the die (152).