发明申请
- 专利标题： CONDUCTIVE BONDED COMPOSITES
- 专利标题（中）： 导电粘结复合材料
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申请号： PCT/GB2014/050126申请日： 2014-01-16
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公开(公告)号： WO2014114915A1公开(公告)日： 2014-07-31
- 发明人: REZAI, Amir , PARFITT, Alexander, Roy , HEMINGWAY, Brett, Edward
- 申请人： BAE SYSTEMS PLC
- 申请人地址： 6 Carlton Gardens London SW1Y 5AD GB
- 专利权人： BAE SYSTEMS PLC
- 当前专利权人： BAE SYSTEMS PLC
- 当前专利权人地址： 6 Carlton Gardens London SW1Y 5AD GB
- 代理机构： BAE SYSTEMS PLC, GROUP IP DEPT
- 优先权： GB1301274.5 20130124
- 主分类号： C09J9/02
- IPC分类号： C09J9/02 ; B29C65/48 ; B64D45/02 ; B29C65/56
摘要：
Methods of bonding and a conductively bonded joint (1) betwen fibre reinforced polymer composite structures (7, 7a), with a conductive adhesive (6, 16) in combination with a conductive intermediary structure (5), more particularly to a lightning strike resilient bonded joint between fibre reinforced polymer composites (7, 7a). A conductive adhesive (6, 16) comprising a curable binder (13) and a high aspect ratio nanoscale carbon particulate filler (14) present in the range of from 0.1 to 40%wt, wherein said particulate filler (14) comprises a conductive coating is also disclosed.
IPC分类:
