The invention relates to a chip assembly (18) having a connection substrate (12) and a plurality of semiconductor substrates arranged on the connection substrate, in particular chips 1, wherein connection surfaces (5) arranged on a contact surface of the chips are connected to connection surfaces on a contact surface of the connection substrate, wherein the chips extend having a side edge parallel to and the contact surface thereof transverse to the contact surface of the connection substrate, wherein through-connections (13) are arranged in the connection substrate which connect outside contacts (15) arranged on an outside contact side to the contact surfaces designed as inside contacts (14) on the contact surface of the connection substrate, wherein connection surfaces of the chips arranged adjacent to the side edge are connected to the inside contacts of the connection substrate via a remelted solder material depot (16). The invention further relates to a method for producing a chip assembly (18).