Invention Application
WO2014128151A1 A SILICON DEVICES / HEATSINKS STACK ASSEMBLY AND A METHOD TO PULL APART A FAULTY SILICON DEVICE IN SAID STACK ASSEMBLY
审中-公开
一种硅装置/散热器堆叠组件和一种方法，用于将APART故障硅设备拉入同一堆叠组件
- Patent Title: A SILICON DEVICES / HEATSINKS STACK ASSEMBLY AND A METHOD TO PULL APART A FAULTY SILICON DEVICE IN SAID STACK ASSEMBLY
- Patent Title (中): 一种硅装置/散热器堆叠组件和一种方法，用于将APART故障硅设备拉入同一堆叠组件
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Application No.: PCT/EP2014/053207Application Date: 2014-02-19
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Publication No.: WO2014128151A1Publication Date: 2014-08-28
- Inventor: RAUBO, Roman , FURYK, Marek , SCHWARTZENBERG, John
- Applicant: ALSTOM TECHNOLOGY LTD
- Applicant Address: Brown Boveri Strasse 7 CH-5400 Baden CH
- Assignee: ALSTOM TECHNOLOGY LTD
- Current Assignee: ALSTOM TECHNOLOGY LTD
- Current Assignee Address: Brown Boveri Strasse 7 CH-5400 Baden CH
- Agency: AHNER PHILIPPE
- Priority: US13/772,296 20130220
- Main IPC: H01L25/11
- IPC: H01L25/11 ; H01L23/34 ; H01L23/40
Abstract:
The invention concerns a silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly. Said silicon devices/heatsinks stack assembly comprises an arrangement of many silicon devices disks (20), two adjacent silicon devices disks (20) being separated by a flat heatsink device (22), each silicon device disk (20) and each heatsink (22) comprising a centering hole on its both faces, a centering pin placed between the adjacent centering holes of a silicon device disk and an adjacent heatsink device. Each heatsink device (22) is pierced with two guide holes (24), at two opposite ends of this one.
Information query
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