A method and apparatus of forming a transparent metal oxide layer on a conductive surface of a dielectric substrate involves exposing first and second conductive surface portions of the conductive surface of the dielectric substrate to first and second electrolytes respectively to form first and second electrochemical cells in which the first conductive surface is part of the first electrochemical cell and the second conductive surface is part of the second electrochemical cell and wherein the electrochemical cells are electrically connected together by the conductive surface of the dielectric substrate. An electric potential applied across first and second counter electrodes in the first and second cells respectively drives an electric current through the first and second electrolytes and causes metal ions and oxygen in the second electrolyte to form the transparent metal oxide layer on the second conductive surface portion when a current is passed through the first and second electrolytes. The transparent metal oxide layer may be made non-conductive or conductive or even semi-conductive through the absence or inclusion of dopant in the second electrolyte. A conductive surface of a dielectric substrate of any length can be uniformly plated with a transparent metal oxide layer by moving the dielectric substrate relative to the first and second electrolytes while exposing the first and second surface portions to the first and second electrolytes respectively.