Invention Application
- Patent Title: BONDED ABRASIVE ARTICLE AND METHOD OF GRINDING
- Patent Title (中): 粘结磨砂制品和研磨方法
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Application No.: PCT/US2014/032384Application Date: 2014-03-31
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Publication No.: WO2014165447A1Publication Date: 2014-10-09
- Inventor: RAMANATH, Srinivasan , LANE, William H. , UPADHYAY, Rachana , HITCHINER, Michael P.
- Applicant: SAINT-GOBAIN ABRASIVES, INC. , SAINT-GOBAIN ABRASIFS
- Applicant Address: One New Bond Street Worcester, Massachusetts 01615 US
- Assignee: SAINT-GOBAIN ABRASIVES, INC.,SAINT-GOBAIN ABRASIFS
- Current Assignee: SAINT-GOBAIN ABRASIVES, INC.,SAINT-GOBAIN ABRASIFS
- Current Assignee Address: One New Bond Street Worcester, Massachusetts 01615 US
- Agency: ABEL LAW GROUP, LLP et al.
- Priority: US61/806,913 20130331
- Main IPC: B24B37/24
- IPC: B24B37/24 ; B24B37/14
Abstract:
An abrasive article configured to grind a workpiece having a fracture toughness of at least about 5.5 MPa•m 0.5 may include a body comprising abrasive particles contained within a bond material comprising a metal, wherein the body comprises a ratio of V AG /V BM of at least about 1.3, wherein V AG is a volume percent of abrasive particles within a total volume of the body and V BM is a volume percent of bond material within the total volume of the body, and wherein the abrasive particles have an average particle size of at least about 1 micron and not greater than about 20 microns.
Information query
