Invention Application
- Patent Title: STRESS RELIEVING SEMICONDUCTOR LAYER
- Patent Title (中): 应力消除半导体层
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Application No.: PCT/US2014036291Application Date: 2014-05-01
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Publication No.: WO2014179523A3Publication Date: 2016-02-04
- Inventor: SHATALOV MAXIM S , YANG JINWEI , SUN WENHONG , JAIN RAKESH , SHUR MICHAEL , GASKA REMIGIJUS
- Applicant: SENSOR ELECTRONIC TECH INC
- Assignee: SENSOR ELECTRONIC TECH INC
- Current Assignee: SENSOR ELECTRONIC TECH INC
- Priority: US201361817970 2013-05-01
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L29/06
Abstract:
A semiconductor structure, such as a group III nitride-based semiconductor structure is provided. The semiconductor structure includes a cavity containing semiconductor layer. The cavity containing semiconductor layer can have a thickness greater than two monolayers and a multiple cavities. The cavities can have a characteristic size of at least one nanometer and a characteristic separation of at least five nanometers.
Information query
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