In various embodiments a method is provided, comprising the steps of: Arranging a wire bond (20) in a capillary (50) for wire-bonding such that a first end of the wire bond (20) extends from a tip of the capillary (50); forming a ball (27) out of the first end of the wire bond (20); leading the wire bond (20) with the ball (27) towards a substrate (14) such that a bond ball (28) is formed on an electric contact area (16) of the substrate (14) by the ball (27); leading the capillary (50) with the wire bond (20) away from the bond ball (28) towards a bond pad (12) on a die (10); leading the capillary (50) towards the bond pad (12) such that the tip of the capillary (50) presses the wire bond (20) against the bond pad (12) and that there is a clearance between the tip of the capillary (50) and the bond pad (12); applying ultrasonic energy on the wire bond (20) on the bond pad (12) in order to fix the wire bond (20) to the bond pad (12), wherein a first portion (54) of the wire bond (20) extends from the bond ball (28) on the substrate (14) to the bond pad (12) on the die (10); increasing the clearance between the bond pad (12) and the capillary (50) tip; leading the wire bond (20) back to the substrate (14); fixing the wire bond (20) to the substrate (14), wherein a second portion (56) of the wire bond (20) extends from the bond pad (12) on the die (10) to the bond ball (28) on the substrate (14).