Invention Application
- Patent Title: PANEL JOINT STRUCTURE
- Patent Title (中): 面板接头结构
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Application No.: PCT/JP2014/071815Application Date: 2014-08-12
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Publication No.: WO2015033783A1Publication Date: 2015-03-12
- Inventor: OGAWA, Satoshi , MIKUNI, Atsushi
- Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Applicant Address: 1, Toyota-cho, Toyota-shi, Aichi 4718571 JP
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: 1, Toyota-cho, Toyota-shi, Aichi 4718571 JP
- Agency: NAKAJIMA, Jun et al.
- Priority: JP2013-186306 20130909
- Main IPC: B60J5/04
- IPC: B60J5/04 ; B21D39/02
Abstract:
A panel joint structure 10 includes: a first panel member 14 that has a first joint portion 14A; a second panel member 16 that is formed of a material having a coefficient of linear expansion different from that of the first panel member 14 and has a second joint portion 16A joined by an elastic adhesive G to the first joint portion 14A; and a projecting portion 18 that is disposed on the second joint portion 16A and contacts the first joint portion 14A to thereby form an interstice S for filling a space between the first joint portion 14A and the second joint portion 16A with the elastic adhesive G.
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