Invention Application
WO2015041844A1 ARTICLES HAVING A MULTILAYER STRUCTURE INCLUDING UNDERCUT FEATURES INTERLOCKED WITH AN ADHESIVE, AND METHODS OF MAKING SAME
审中-公开
具有多层结构的文章,包括与粘合剂相互联系的底层特征及其制造方法
- Patent Title: ARTICLES HAVING A MULTILAYER STRUCTURE INCLUDING UNDERCUT FEATURES INTERLOCKED WITH AN ADHESIVE, AND METHODS OF MAKING SAME
- Patent Title (中): 具有多层结构的文章,包括与粘合剂相互联系的底层特征及其制造方法
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Application No.: PCT/US2014/053831Application Date: 2014-09-03
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Publication No.: WO2015041844A1Publication Date: 2015-03-26
- Inventor: RULE, Joseph D. , PEREZ, Mario A. , LEWANDOWSKI, Kevin M. , FOLLENSBEE, Robert A.
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: 3M Center Post Office Box 33427 Saint Paul, Minnesota 55133-3427 US
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: 3M Center Post Office Box 33427 Saint Paul, Minnesota 55133-3427 US
- Agency: PISHKO, Adrian L. et al.
- Priority: US61/879,295 20130918
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B32B27/30 ; B32B3/30 ; B32B27/32 ; B32B9/04 ; B32B15/085 ; B32B17/06 ; B32B21/08 ; B32B25/08 ; B32B27/06 ; B32B27/08 ; B32B27/10 ; B32B27/12
Abstract:
Articles are provided, having a multilayer structure including (a) a first layer formed from polyolefin and including undercut features formed on and extending from an integral backing; (b) a second layer including an adhesive having a Shore D hardness of greater than 59 when cured; and (c) a third layer including a substrate. The second layer is interlocked with the undercut features, the third layer is adhered to the adhesive, and the second layer is disposed between the first layer and the third layer. A method is also provided including (a) depositing a polyolefin resin into a mold cavity to form a first layer including undercut features; (b) demolding the first layer from the mold cavity at a rate of at least 150 millimeters per minute; (c) applying a curable adhesive to the undercut features to form a second layer attached to the first layer; and (d) attaching a third layer including a substrate to the second layer.
Information query