A nonwoven web having an advantageous bond pattern impressed by a bonding pattern on a roller is disclosed. The bonding pattern is selected to have a bonding area percentage from 6 to 14 percent, which provides a desirable level of bonding of filaments and/or fibers for mechanical strength, while retaining desirable pliability and/or liquid handling characteristics. The bonding area is also relatively highly dispersed, which provides for a relatively greater number of bonded areas for the selected bonding area percentage. The greater number of bonded areas is believed to provide improved structural integrity while still retaining pliability and/or liquid handling characteristics, and also provide for enhanced visual detail and complexity. The relatively highly dispersed bonding area is believed to be particularly effective for nonwoven web materials having three or more layers, with outer layers of polymeric filaments, and even more particularly, one or two outer layers of fine filaments.