Invention Application
WO2015110210A1 APPARATUS OPERABLE TO PERFORM A MEASUREMENT OPERATION ON A SUBSTRATE, LITHOGRAPHIC APPARATUS, AND METHOD OF PERFORMING A MEASUREMENT OPERATION ON A SUBSTRATE
审中-公开
可用于执行基板上的测量操作的装置，地平面设备以及在基板上执行测量操作的方法
- Patent Title: APPARATUS OPERABLE TO PERFORM A MEASUREMENT OPERATION ON A SUBSTRATE, LITHOGRAPHIC APPARATUS, AND METHOD OF PERFORMING A MEASUREMENT OPERATION ON A SUBSTRATE
- Patent Title (中): 可用于执行基板上的测量操作的装置，地平面设备以及在基板上执行测量操作的方法
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Application No.: PCT/EP2014/076678Application Date: 2014-12-05
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Publication No.: WO2015110210A1Publication Date: 2015-07-30
- Inventor: SLOTBOOM, Daan, Maurits , KRAMER, Pieter, Jacob , LEENDERS, Martinus, Hendrikus, Antonius , PAARHUIS, Bart, Dinand
- Applicant: ASML NETHERLANDS B.V.
- Applicant Address: P.O. Box 324 NL-5500 AH Veldhoven NL
- Assignee: ASML NETHERLANDS B.V.
- Current Assignee: ASML NETHERLANDS B.V.
- Current Assignee Address: P.O. Box 324 NL-5500 AH Veldhoven NL
- Agency: MAAS, Abraham
- Priority: EP14152452.0 20140124
- Main IPC: G03F9/00
- IPC: G03F9/00
Abstract:
Disclosed is an apparatus and method for performing a measurement operation on a substrate in accordance with one or more wafer alignment models. The one or more wafer alignment models are selected from a plurality of candidate wafer alignment models. The apparatus, which may be a lithographic apparatus, comprises an external interface which enables selection of the wafer alignment model(s) and/or alteration of the wafer alignment model(s) prior to said measurement operation.
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