Invention Application
- Patent Title: HIGH SPEED EPI SYSTEM AND CHAMBER CONCEPTS
- Patent Title (中): 高速EPI系统和机箱概念
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Application No.: PCT/US2015/010357Application Date: 2015-01-06
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Publication No.: WO2015112328A1Publication Date: 2015-07-30
- Inventor: BURROWS, Brian H. , SCUDDER, Lance A. , MAQSOOD, Kashif , ANDERSON, Roger N. , ACHARYA, Sumedh Dattatraya
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: 3050 Bowers Avenue Santa Clara, California 95054 US
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: 3050 Bowers Avenue Santa Clara, California 95054 US
- Agency: PATTERSON, B. Todd et al.
- Priority: US61/932,035 20140127
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/02
Abstract:
Embodiments described herein generally relate to a batch processing chamber. The batch processing chamber includes a lid, a chamber wall and a bottom that define a processing region. A cassette including a stack of susceptors for supporting substrates is disposed in the processing region. The edge of the cassette is coupled to a plurality of shafts and the shafts are coupled to a rotor. During operation, the rotor rotates the cassette to improve deposition uniformity. A heating element is disposed on the chamber wall and a plurality of gas inlets is disposed through the heating element on the chamber wall. Each gas inlet is substantially perpendicular to the chamber wall.
Information query
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