Methods of forming solder bumps or joints using a radiation curable, thermal curable solder flux, or dual curable solder flux are disclosed. The method includes applying a liquid solder flux 130 that is radiation curable or thermal curable to a substrate 110 such that the solder flux covers contact padsl20 on the substrate; placing solder balls 140 on the contacts pads covered with the radiation curable or thermal curable solder flux; heating the substrate to join the solder balls to the contact pads, thereby forming solder bumps or solder joints 150; and curing the liquid solder flux by applying radiation or heat to the substrate, thereby forming a solid film 160. The solder flux includes radiation curable, thermally curable, or dual curable materials that aid formation of solder bumps or joints before the solder flux is cured; and are curable to form a solid material by the application of radiation or heat.