公开(公告)号：WO2015138905A1

公开(公告)日：2015-09-17

申请号：PCT/US2015/020456

申请日：2015-03-13

Applicant: INDIUM CORPORATION

Inventor： HU, Ming ,  LEE, Ning-Cheng

IPC: H05K3/34 ,  B23K1/20 ,  C08K5/09 ,  H01L23/00

CPC classification number: B23K35/362 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/203 ,  B23K3/0623 ,  B23K35/3612 ,  B23K35/3613 ,  B23K2201/42 ,  C08K5/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/03828 ,  H01L2224/10126 ,  H01L2224/11011 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/131 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2203/041 ,  H05K2203/043 ,  H01L2924/014

Abstract: Methods of forming solder bumps or joints using a radiation curable, thermal curable solder flux, or dual curable solder flux are disclosed. The method includes applying a liquid solder flux 130 that is radiation curable or thermal curable to a substrate 110 such that the solder flux covers contact padsl20 on the substrate; placing solder balls 140 on the contacts pads covered with the radiation curable or thermal curable solder flux; heating the substrate to join the solder balls to the contact pads, thereby forming solder bumps or solder joints 150; and curing the liquid solder flux by applying radiation or heat to the substrate, thereby forming a solid film 160. The solder flux includes radiation curable, thermally curable, or dual curable materials that aid formation of solder bumps or joints before the solder flux is cured; and are curable to form a solid material by the application of radiation or heat.

Abstract translation: 公开了使用可辐射固化的，可热固化的焊剂焊剂或双重可固化的助焊剂形成焊料凸块或接头的方法。 该方法包括将可辐射固化或可热固化的液体助焊剂130应用于衬底110，使得焊剂覆盖衬底上的接触垫片20; 将焊球140放置在用可辐射固化或热固化焊剂覆盖的接触焊盘上; 加热衬底以将焊球接合到接触焊盘，从而形成焊料凸块或焊点150; 以及通过向衬底施加辐射或加热来固化液体焊剂，由此形成固体膜160.焊剂包括可辐射固化的，可热固化的或双重可固化的材料，其在焊剂固化之前有助于形成焊料凸块或接头 ; 并且通过施加辐射或热量可固化以形成固体材料。