Invention Application
WO2015150500A1 COVER LID, HOUSING FOR ELECTRIC OR ELECTROMAGNETIC APPLICATIONS AND METHOD OF ASSEMBLY OF A HF HOUSING
审中-公开
用于电气或电磁应用的盖子,壳体和HF壳体的组装方法
- Patent Title: COVER LID, HOUSING FOR ELECTRIC OR ELECTROMAGNETIC APPLICATIONS AND METHOD OF ASSEMBLY OF A HF HOUSING
- Patent Title (中): 用于电气或电磁应用的盖子,壳体和HF壳体的组装方法
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Application No.: PCT/EP2015/057268Application Date: 2015-04-01
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Publication No.: WO2015150500A1Publication Date: 2015-10-08
- Inventor: KRAUSE, Rainer , WEITZENBERGER, Wilhelm , LITWA, Cornelia , SCHWAIGER, Oliver
- Applicant: KATHREIN-WERKE KG
- Applicant Address: Anton-Kathrein-Str. 1-3 83004 Rosenheim DE
- Assignee: KATHREIN-WERKE KG
- Current Assignee: KATHREIN-WERKE KG
- Current Assignee Address: Anton-Kathrein-Str. 1-3 83004 Rosenheim DE
- Agency: 24IP LAW GROUP SONNENBERG FORTMANN
- Priority: GB1406149.3 20140404
- Main IPC: H05K9/00
- IPC: H05K9/00
Abstract:
A cover lid (50) for a housing (1) for electric or electromagnetic applications, such as a housing for a coupler or a filter, and designed to reduce passive intermodulation (PIM) is disclosed. The cover lid comprises a cover lid plate (52) having a bottom plate surface (53), an upper plate surface (54), the upper plate surface being arranged substantially parallel to the bottom plate surface, and a lateral lid surface (55) joining the bottom plate surface and the upper plate surface, wherein the lateral lid surface (55) comprises a bevelled portion (58). A housing (10) comprises a cover lid (50) press fitted into the cover lid reception space (20). The invention also discloses a method of assembly of the housing with a cover lid, which is press fitted into the housing.
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