Embodiments of the invention include systems, methods and apparatus for pre-cleaning a substrate after chemical mechanical planarization processing. Embodiments provide a housing; a chuck assembly configured to securely hold a substrate within the housing; and a buffing pad assembly configured to rotate against the substrate while supported within the housing. The buffing pad assembly includes a buff pad, a compressible sub-pad coupled to the buff pad, and a pad holder coupled to the compressible sub-pad and a buffing motor configured to rotate the buffing pad assembly. Numerous additional aspects are disclosed.